Hyulim Robot Wafer Transfer Robot

The Hyulim Robot Wafer Transfer Robot is designed for automated wafer handling in semiconductor manufacturing. The range includes vacuum and atmospheric types for different operating environments. The vacuum type uses a dual-arm design with 4 moving axes. The AR-WV300 model supports wafers up to 300 mm, with a 50 mm Z-axis stroke and a payload of 700 g including the hand.

The atmospheric type is available in single-arm and dual-arm configurations. Models include the AR-S300H, AR-W300H and AR-S300R, supporting wafers up to 300 mm. Z-axis stroke is up to 300 mm, with payloads from 500 g to 3 kg including the hand.