Fortrend Curing Oven

The Fortrend Curing Oven is a thermal processing system designed for semiconductor wafer curing and heat treatment. The FVO-450 Series is designed for 200 mm SMIF wafers and features an ultra-clean vacuum curing chamber.

The FVO-450 Series supports curing temperatures of up to 450°C ±3°C. It provides a maximum heating ramp of 6°C per minute and a cooling ramp of 4°C per minute. The process can operate under vacuum at 10 Torr with 1 to 3 gases.

Three configurations are available: FVO-450-1 single-chamber, FVO-450-2 dual-chamber and FVO-450-G2 high-precision dual-chamber systems. The single-chamber model handles up to 50 wafers, while the dual-chamber model handles up to 100 wafers.

The Fortrend Curing Oven supports processes including thermal cure, annealing, moisture removal, PI cure, photoresist removal and BCB cure/re-flow. It is designed for high reliability, full automation and ultra-clean wafer processing.